TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY, Advancing America's Defense Electronics Industrial Base
SANTA ANA, Calif., June 22, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (“Ultra-HDI”) printed circuit board (“PCB”) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing
SANTA ANA, Calif., June 22, 2026 (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (NASDAQ: TTMI) (“TTM”), a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (“Ultra-HDI”) printed circuit board (“PCB”) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.
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