Soitec and ZenSemi Partner to Scale 300mm BCD-on-SOI Production for Next-Generation Power Electronics
Bernin (Grenoble), France, June 29, 2026 - Soitec, a world leader in the design and manufacturing of innovative semiconductor materials, and ZenSemi, a premier specialty foundry in China, today announced a strategic collaboration to enable high-volume production of 300mm BCD-on-SOI (Bipolar-CMOS-DMOS on Silicon-on-Insulator) technologies for next-generation power electronics powering AI datacenters, EVs, humanoid robots and industrial applications.
Bernin (Grenoble), France, June 29, 2026 - Soitec, a world leader in the design and manufacturing of innovative semiconductor materials, and ZenSemi, a premier specialty foundry in China, today announced a strategic collaboration to enable high-volume production of 300mm BCD-on-SOI (Bipolar-CMOS-DMOS on Silicon-on-Insulator) technologies for next-generation power electronics powering AI datacenters, EVs, humanoid robots and industrial applications.
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