Himax Strengthens 3D Sensing Portfolio with Launch of New iToF Depth Decoder ICs for Robotics and Intelligent Vision Applications
TAINAN, Taiwan, June 30, 2026 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the launch of its new HE Series indirect Time-of-Flight (iToF) Depth Decoder ICs, further expanding Himax’s portfolio in 3D sensing and machine vision applications. Leveraging a high-performance hardware-based depth processing architecture, advanced image enhancement tec
TAINAN, Taiwan, June 30, 2026 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced the launch of its new HE Series indirect Time-of-Flight (iToF) Depth Decoder ICs, further expanding Himax’s portfolio in 3D sensing and machine vision applications. Leveraging a high-performance hardware-based depth processing architecture, advanced image enhancement technologies, and a comprehensive hardware and software development platform, the new iToF decoder IC delivers high-frame-rate and high-precision 3D sensing capabilities, providing a complete, easy-to-integrate 3D sensing solution for robotics, industrial automation, and a broad range of AI vision applications.
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