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MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds

Markets GlobeNewswire By GlobeNewswire 08 Jun 2026 12:15 1 min read
MACOM Introduces its Hot Via Chip Scale Technology to Eliminate Wire Bonds

MACOM, a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology.

MACOM, a leading supplier of semiconductor products, today announced a chip scale hot via process built on its AlGaAs diode technology.

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